1 Materials Behavior 1
Introduction 1
Process Innovation as Driver of Technological Growth 2
Single-Crystal Turbine Blades 2
Copper Interconnects for Microelectronic Packages 2
Tungsten Filament for Light Bulbs 3
Tailor-Welded Blanks 3
Atomic Bonding in Materials 4
Crystal Structure 6
Defects in Crystalline Solids 10
Annealing 14
Diffusion in Crystalline Solids 17
Mechanical Behavior 21
Strengthening of Metals 26
Fracture Mechanics 27
Fatigue 31
Creep 34
Deformation Processing 35
Heat Treatment 35
Precipitation Hardening 44
Thermal Properties 45
Electrical Properties 48
Dielectric and Magnetic Properties 50
Optical Properties 52
2 Casting and Solidification 57
Casting Techniques 57
Expendable-Mold Casting 58
Green Sand Casting 58
Thermal Considerations 65
Dry Sand and Skin-Dried Molds 69
Sodium Silicate-CO2 Process 69
Vacuum Molding 70
Shell-Molding 71
Investment Casting 72
Lost-Foam Casting 74
Other Expendable Mold Processes 75
Multiple-Use Mold Casting 75
Permanent Mold Casting 75
Die Casting and Semisolid Casting 77
Squeeze Casting 83
Centrifugal Casting 86
Continuous Casting 86
Single-Crystal Casting and Directionally Solidified Structure 86
Fluidity 95
Melt Treatments 98
Metallic Foams and Gasars 100
Melting Furnaces 102
Mold-Filling Time 102
Gate and Runner Area Calculation 105
Temperature Drop in Metal Flow 106
Riser Design 111
Naval Research Lab Method 113
Riser Size Estimation Using Chvorinov’s Rule 116
Solidification Rate 119
Sand Mold 119
Die Casting 122
Stages of Solidication—Nucleation and Growth 125
Nucleation 125
Homogeneous Nucleation 126
Heterogeneous Nucleation 130
Nucleation and Grain Refinement 133
Growth During Solidification 134
Atomic Structure at the Solidification Interface 134
Growth in Pure Metals 137
Growth of Single-Phase Alloys 139
Constitutional Supercooling and Interface Instability 142
Eutectic Solidification 146
Solidification of Industrial Castings： 149
Grain Structure 149
Segregation 151
Constrained Solidification in Small Regions 153
Rapid Solidification and Metallic Glass 157
Weld Solidification 158
Solidification Under Reduced Gravity 160
Interactions of Solidification Front with Insoluble Particles 162
3 Powder Metallurgy and Ceramic Forming 167
Crystalline Ceramics and Glasses 167
Powder Metallurgy 172
Powder Production 172
Solidification of Atomized Droplets 174
Other Methods of Powder Manufacture 176
Particle Size and Shape 177
Powder Mixing 179
Powder Compaction 180
Dynamics of Powder Densification 181
Isostatic Compaction and Hot Isostatic Compaction（HIP） 185
Analysis of Pressure Distribution in Uniaxial Compaction 185
Pressure Distribution in an Annular Cylinder 187
Powder Injection-Molding（PIM） 188
Rheological Considerations in Powder Injection-Molding 191
Settling and Segregation in Powder Injection-Molding Slurries 195
Sintering 197
Mechanism of Sintering 198
Other Considerations in Sintering 203
Homogenization 203
Coarsening 205
Ceramic Forming 207
Slip-Casting 207
Tape-Casting 213
Ceramic Extrusion 215
Electrolytic and Electrophoretic Deposition 216
Glass Forming 220
Pore Characterization 224
Properties of Ceramics 227
Mechanical Properties 227
Thermal Properties 232
Electrical and Electronic Properties 235
Oxidation and Corrosion Resistance 237
Bioceramics and Porous Ceramic Foams 240
Joining of Ceramics 241
4 Surface，Subsurface，and Interface Phenomena 247
Surface Forces 248
Electrostatic Forces 248
Van der Waals Forces 250
Contact Angle，Surface Tension，and Young’s Equation 251
Grain Boundaries in Polycrystals 254
Three-Phase Equilibrium 255
Microscopic Angles and Precursor Film 257
Roughness and Chemical Inhomogeneity 257
Dynamic Contact Angles 260
Immersion of Solids in Liquids 264
Gas-Solid Attachment and Gas Stabilization 268
Agglomeration 268
Capillary Flow 273
Capillary Pressure 273
Capillary Rise 275
Wettability and Capillary Rise at High Temperatures 280
Effect of Oxide on Liquid 280
Alloying and Surface Coatings 282
Reactive Infiltration 283
Reactive Penetration 285
Capillary Flow with Unsteady Contact Angle and Pore Size 286
Joining 289
Adhesion 296
Capillarity in Miscellaneous Other Processes 298
Wear，Friction，and Lubrication 301
Corrosion 307
5 Coatings and Surface Engineering 313
Design and Development of Coatings 313
Surface Pretreatments 314
Coating Techniques 316
Vapor-Phase Deposition 316
Nucleation and Growth in Vapor Condensation 320
Ion-Nitriding 324
Thermal Spray-Coating 325
Physical Considerations in Thermal Spraying 326
Structure，Properties，and Applications of Thermal Spray Coatings 332
Electroplating 338
Physical Considerations 338
Plating Practice 339
Electroless Plating 343
Anodizing 345
Coatings on Powders and Fibers 348
Organic Coatings—Paints and Powders 348
Powder Coatings 351
Electrostatic Powder Spray 351
Electrocoating 352
Conversion Coatings 353
Vitreous Ceramic Coatings 353
Surface Hardening 355
Selective Hardening 355
Diffusion Hardening 357
Laser Surface-Engineering 361
Laser-Materials Interaction 361
Types of Lasers 362
Lasers as Surface-Engineering Tools 363
Characteristics of Laser Surface Engineering 364
Laser Surface Heating 368
Laser Surface Melting 372
Solidification Structure 374
Laser Surface Alloying 377
Laser-Induced Ceramic Coating 381
Laser-Cladding 382
Laser-Induced Combustion Synthesis 387
Laser Surface-Vaporization 387
Laser Surface-Texturing 388
Laser Surface Cleaning 390
Laser Surface-Marking 391
Laser Surface-Shocking 391
Miscellaneous Laser Processes 391
Residual Stress State of Laser-Treated Surface 392
Promise of Lasers in Surface-Engineering 394
6 Composite Materials 397
Definition and Classification 397
Fibers 398
Glass 399
Boron 399
Carbon Fiber 400
Organic Fibers 402
Metallic Fibers 402
Ceramic Fibers 403
Interface 406
Fiber Strengthening 409
Polymer-Matrix Composites 410
Matrix 410
Properties of Polymeric Matrices 414
Polymer Composites 414
Ceramic-Matrix Composites 418
Carbon-Carbon Composites 423
Chemical Vapor Infiltration 425
Metal-Matrix Composites 429
Heat-Resistant Composites 429
Dispersion-Strengthened Composites 429
In Situ Composites 433
Particulate and Fiber-Reinforced High-Temperature Alloys 436
Fabrication of Metal-Matrix Composites 439
Solid-State Fabrication 440
Liquid-State Fabrication 445
Infiltration 445
Reactive Infiltration 448
Stirring Techniques 453
Low-Cost Composites by Casting 455
Other Liquid-Phase Techniques 457
Wettability and Bonding 458
Ni-Base Composites 458
Properties 460
Interface Strength 460
Fiber Strength 467
Stiffness，Strength，and Ductility 469
Fatigue and Fracture Toughness 475
Other Properties 476
Creep 476
Vibration Damping 477
Wear and Friction 477
Thermal Properties 480
Thermal Fatigue 482
Oxidation Resistance 483
7 Semiconductor Manufacturing 485
Introduction 485
Integrated Circuit Applications and Market 485
Feature Size and Wafer Size 486
Technology Trends 489
Fundamentals of Semiconductors 489
Crystal Structure of Silicon 489
Energy Band Theory 493
The Fermi Level 495
Intrinsic Semiconductor 495
Extrinsic Semiconductor 497
Dopant Concentration and Conductivity 498
Diodes 498
Bipolar Junction Transistors（BJT） 500
Metal Oxide Field Effect Transistors（MOSFET） 503
Crystal Growth and Wafer Preparation 504
Czokhralski Method 505
Floating-Zone Method 506
Defects 507
Wafer Preparation 510
Initial Steps 510
Wafer Slicing 510
Postslicing Polishing and Cleaning 511
Oxidation 512
Properties of Silicon Dioxide 512
Oxidation Techniques 512
Oxidation Furnaces and Factors Affecting Oxide Growth 514
Characterization of Oxide Films 515
Simulation 517
Diffusion 517
Fick’s Diffusion Equations 518
Constant Source Diffusion 519
Limited Source Diffusion 519
Diffusion Coefficient 520
Concentration-Dependent Diffusion 520
Lateral Diffusion 521
Junction Depth 521
Sheet Resistance 521
Simulation 522
Ion Implantation 522
Ion Implanter 522
Channeling 523
Implantation Damage 524
Annealing 524
Rapid Thermal Annealing 524
Photolithography 524
Introduction 524
Optical Lithography 526
The Clean Room 526
The Pattern Transfer Process 527
Exposure Systems 530
Masks and Resists 532
Thin Film Deposition 532
Vacuum Deposition Techniques 532
Physical Vapor Deposition 532
Evaporation 533
Sputtering 534
Reactive Sputtering 535
Radio Frequency（RF）Sputtering 535
Magnetron Sputtering 535
Collimated Sputtering 535
Ionized Magnetron Sputtering 536
Chemical Vapor Deposition 536
Epitaxy 537
Molecular Beam Epitaxy 537
Nonvacuum Deposition Techniques 537
Chemical Bath Deposition 537
Spin-On Deposition 538
Etching 538
Introduction 538
Etching Types 538
Wet Etching 538
Dry Etching 539
Ion Beam Milling 539
Plasma Etching 540
Reactive Ion Etching 540
Metallization 540
Ohmic Contacts 540
Metals and Alloys 541
Junction Spiking 541
Electromigration 542
Copper Metallization 542
Damascene Technology 543
Chemical Mechanical Polishing（CMP） 544
Silicide 544
Packaging 546
Traditional Packaging 546
Advanced Packaging 547
Yield and Reliability 548
Yield 548
Processing Effects 548
Circuit Sensitivities 548
Point Defects 549
Reliability 549
8 Nanomaterials and Nanomanufacturing 551
Introduction 551
Nanotubes，Nanoparticles，and Nanowires 552
Methods Using Solid Precursors 554
Inert Gas Condensation 554
Pulsed Laser Ablation 555
Ion Sputtering 557
Methods Using Liquid or Vapor Precursor 557
Chemical Vapor Synthesis 557
Laser Pyrolysis 557
Synthesis of Nanopaicles by a Chemical Methods 557
Nanoparticles：Biomedical Applications 558
Tissue Engineering 560
Manipulation of Cells and Biomolecules 561
Protein Detection 562
Cancer Therapy 562
Semiconductor Nanowires 563
General Synthetic Strategies 563
Fabrication of Semiconductor Nanowires 565
Fabrication of Metal Nanowires 569
Electrochemical Fabrication of Metal Nanowires 571
Negative Template Methods 571
Anodic porous Alumina 572
Fabrication of Metal Nanowires 573
Positive Template Method 575
Carbon Nanotube Template 575
DNA Template 575
Polymer Templates 576
Applications of the Nanowires 579
Magnetic Materials and Devices 579
Optical Applications 580
Biological Assays 580
Chemical Sensors 581
Carbon Nanotubes 581
Structure of the Carbon Nanotube 583
Synthesis of Carbon Nanotubes 585
Growth Mechanisms of Carbon Nanotubes 587
Carbon Nanotube Composite Materials 588
Polymer NanoComposites 590
Ceramic NanoComposites 591
Ceramic Nanotube Composite Systems 593
Ceramic-Coated MWNTs and SWNTs 594
Conductive Ceramics 595
Nanostructured Metals and Metal Composites 595
Solid-State Powder-Based Processing 596
Liquid-Phase Processing 597
Surface，Interface，Nucleation and Reactivity 599
Agglomeration，Dispersion and Sedimentation 601
Properties 602
Strength and Modulus 602
Nanotribology 603
Carbon Nanotubes：Biosensor Applications 603
FET-Based Biosensors 604
Aligned Nanoelectrode Array-Based Electronic Chips 605
Index 615