当前位置:首页 > 语言文字
电子制造工程专业英语
电子制造工程专业英语

电子制造工程专业英语PDF电子书下载

语言文字

  • 电子书积分:8 积分如何计算积分?
  • 作 者:金鸿主编;吴非副主编
  • 出 版 社:北京:高等教育出版社
  • 出版年份:2011
  • ISBN:9787040324488
  • 页数:145 页
图书介绍:本书旨在使读者掌握电子制造工程专业群的英语术语及用法,培养和提高读者阅读和翻译专业英语文献资料的能力,为今后获取和交流专业技术信息打下良好的基础。全书共18课,内容包括电的本质、电场、简单电路、半导体材料、电化学基础、光化学基础、电子封装、印制电路板成像、电镀技术、柔性电路、柔性电路的检测、显示技术简介、液晶显示、等离子显示、发光二极管、半导体器件及集成电路、半导体制造工艺、封装及测试等。每课由课文、语法(或翻译或应用文)和扩展阅读组成。本书还简单介绍了翻译知识,并配有适量的练习与扩展阅读材料,供教师选用和学生自学用。本书内容新颖、图文并茂、浅显易学,光电子技术、电子电路设计与工艺、微电子技术、光伏发电技术及应用等专业的专业英语教材或教学参考书,也可供从事电子制造工程等专业的工程技术人员学习参考。
《电子制造工程专业英语》目录

Lesson One 1

Part Ⅰ Intensive Reading: The Nature of Electricity 1

Part Ⅱ Grammar: Parts of Speech 6

Part Ⅲ Extensive Reading: Why do We Get a Shock from Electricity? 7

Lesson Two 9

Part Ⅰ Intensive Reading: Electric Field, Potential and Voltage 9

Part Ⅱ Grammar: Prefix and Suffix 13

Part Ⅲ Extensive Reading: Electric Field and Electric Field Lines 15

Lesson Three 18

Part Ⅰ Intensive Reading: Simple Electric Circuit 18

Part Ⅱ Grammar: Word-Formation 23

Part Ⅲ Extensive Reading: DC Biasing—BJTs 24

Lesson Four 26

Part Ⅰ Intensive Reading: Semiconductor Material 26

Part Ⅱ Grammar: Word-activity 30

Part Ⅲ Extensive Reading: Growth of Semiconductor Materials 31

Lesson Five 33

Part Ⅰ Intensive Reading: Electrochemistry Basis 33

Part Ⅱ Grammar: Sentence Backbones 38

Part Ⅲ Extensive Reading: The History of Electrochemistry 39

Lesson Six 43

Part Ⅰ Intensive Reading: Photochemistry Basis 43

Part Ⅱ Grammar: Sentence Elements 47

Part Ⅲ Extensive Reading: Photolithography Introduction 49

Lesson Seven 51

Part Ⅰ Intensive Reading: Electronic Package and High-density Interconnectivity 51

Part Ⅱ Grammar: Complex Sentence Ⅰ 55

Part Ⅲ Extensive Reading: Electronic Packaging 57

Lesson Eight 59

Part Ⅰ Intensive Reading: Printed Circuit Board Imaging 59

Part Ⅱ Grammar: Complex sentence Ⅱ 63

Part Ⅲ Extensive Reading: HannStar Board-GBM Consolidation to Create Largest PCB Maker in Taiwan Province 64

Lesson Nine 66

Part Ⅰ Intensive Reading: Plated-Through-Hole (PTH) Technology 66

Part Ⅱ Translation Skills: Translation Standards and Process 71

Part Ⅲ Extensive Reading: The Disadvantages of Pattern Plating 72

Lesson Ten 74

Part Ⅰ Intensive Reading: Flexible Circuits 74

Part Ⅱ Translation Skills: Conversion of Part of Speech 78

Part Ⅲ Extensive Reading: Design of Flexible Circuits 80

Lesson Eleven 81

Part Ⅰ Intensive Reading: Inspection and Test of Flexible Circuits 81

Part Ⅱ Translation Skills: Translation of Complex Sentences in Scientific English 86

Part Ⅲ Extensive Reading: Printed Electronics Make PCB “Green Up” 87

Lesson Twelve 89

Part Ⅰ Intensive Reading: Introduction of Display Technology 89

Part Ⅱ Translation Skills: Amplification and Deletion 95

Part Ⅲ Extensive Reading: Flat Panel Buying Tips 96

Lesson Thirteen 99

Part Ⅰ Intensive Reading: Liquid Crystal Display 99

Part Ⅱ Practical Writing: Resume 104

Part Ⅲ Extensive Reading: High Luminance and Wide Color Gamut—for clear, vivid color 106

Lesson Fourteen 107

Part Ⅰ Intensive Reading: Plasma Display Panel 107

Part Ⅱ Practical Writing: Cover Letter 112

Part Ⅲ Extensive Reading: Full HD Plasma Panel Creates a True Full HD 3D World 113

Lesson Fifteen 115

Part Ⅰ Intensive Reading: Light Emitting Diodes 115

Part Ⅱ Practical Writing : Reference Letter 119

Part Ⅲ Extensive Reading: Organic Light Emitting Diodes 120

Lesson Sixteen 122

Part Ⅰ Intensive Reading: Semiconductor Devices and Integrated Circuits 122

Part Ⅱ Practical Writing: Advertisement 127

Part Ⅲ Extensive Reading: How Solar Cells Work? 128

Lesson Seventeen 130

Part Ⅰ Intensive Reading: Semiconductor Manufacturing Processes 130

Part Ⅱ Practical Writing : Self-Introduction 135

Part Ⅲ Extensive Reading: Photolithography 136

Lesson Eighteen 137

Part Ⅰ Intensive Reading: Packaging and Testing 137

Part Ⅱ Practical Writing: Work Report 141

Part Ⅲ Extensive Reading: Chip Scale Package 142

Reference 144

返回顶部