集成电路封装材料的表征 英文PDF电子书下载

IC PACKAGE RELIABILITY TESTING 1

1.1 Introduction 1

1.2 In-Process Quality Measurements 2

Wire Bond Quality 3

Die Attach Quality 4

Other Process Control Measurements 8

1.3 Package-Oriented Reliability Testing of Finished Devices:Moisture Testing 10

Failure Analysis of Moisture-Related Failures 11

Root Causes of Corrosion Failures 12

1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing 14

Bond Failures:Bond Pad Contamination 16

Intermetallic Formation and Other Elements of Bond Formation 18

1.5 Reliability Test Preconditioning:A New Direction 23

1.6 Summary 25

MOLD COMPOUND ADHESION AND STRENGTH 27

2.1 Introduction 27

2.2 Thermodynamic Consideration of Adhesion 28

Work of Adhesion 28

The Work of Adhesion from Contact Angle Measurements 30

Work of Adhesion in the Presence of Moisture and Lubricants 30

2.3 Adhesive Strength for Various Mold Compound Types 31

Adhesive Strength Measurements 31

Mold Compound Types 31

Adhesive Strength of Various Mold Compounds 32

2.4 Various Factors Which Influence Adhesion Strength 33

Effects of Lead Frame Oxides 34

Effects of Different Lead Frame Materials 38

Effects of Adhesion Promoters 40

Effects of Various Mold Release and Processing Aids 41

Effects of Mold Compound Rheology 42

2.5 Role of Adhesion in Surface Mount Operations 43

Moisture Absorption and Its Effect on Adhesion 45

Package Delamination and Cracking in VPR and SDIP 45

2.6 Role of Adhesion in Package Reliability 48

Metal Line Movement 48

Highly Accelerated Stress Test(HAST) 49

2.7 Physical Characterization of Mold Compounds 49

Physical Properties of Various Mold Compounds 49

Cure Kinetics 51

2.8 Outlook for Future Mold Compounds 53

2.9 Summary 54

MECHANICAL STRESS IN IC PACKAGES 57

3.1 Introduction 57

3.2 Stress and Strain Relations:An Overview 58

3.3 Stress Generation in IC Packages 61

3.4 Tools for Stress Determination in IC Packages 63

Finite Element Analysis 64

Strain Gauges for Stress Analysis 64

Moire Interferometry 64

Indirect Stress Determination 64

3.5 Application of Techniques to IC Packaging Problems 64

Eutectic Die Attach 65

Passivation Damage at Chip Corners 66

Ball Bond Stresses 68

Solder Reflow Damage 69

Tape Automated Bonding Inner Lead Stresses 72

Filler Particle-Induced Damage 73

Mechanical Warpage 73

Mechanical Damage 74

Parametric Shifts Related to Package Stresses 74

3.6 Solder Joint Stress and the Coffin-Manson Relation 75

3.7 Summary 76

MOISTURE SENSITIVITY AND DELAMINATION 79

4.1 Introduction 79

4.2 Moisture/Reflow Sensitivity Evaluations 81

Moisture Sensitivity Classification 81

Moisture Absorption:Preconditioning 83

Solder Reflow Damage 85

4.3 Impact on Temperature-Cycle Performance 91

4.4 Impact on THB Performance 92

4.5 Moisture Desorption:Bake-Out 93

4.6 Summary 94

THERMAL MANAGEMENT 97

5.1 Introduction 97

5.2 IC Package Thermal Characteristics 99

5.3 Factors Affecting Package Thermal Resistance 105

Package Design 105

Package Material Thermal Conductivity 107

Die Attach Material 111

Package Size and Die Size Effects 111

Package Defects 112

PCB Effect on Thermal Performance 113

The Effect of Neighboring Components 114

Heat Fins 115

5.4 Thermal Design Challenges of Multi-Chip Modules 115

5.5 Summary 116

ELECTRICAL PERFORMANCE OF IC PACKAGES 121

6.1 Introduction 121

6.2 Designing for Performance 123

6.3 Electrical Models for Packages and Interconnects 125

Low Frequency Models 125

6.4 Propagation Delay and Packaging 127

Clock Frequency,Bandwidth,and Rise Time 127

Propagation Delay 128

RC Delay 128

Time of Flight 128

6.5 Switching Noise 130

6.6 Signal Integrity 134

6.7 Crosstalk 135

6.8 Materials and Design Trends for High-Performance Packaging 138

6.9 Summary 143

SOLDERABILITY OF INTEGRATED CIRCUITS 145

7.1 Introduction 145

7.2 Electronic Soldering Basics 146

Soldering Definitions 146

Solder Joints for Electronic Packages 147

Solderability Defect Classifications 147

7.3 IC Package Designs,Materials,and Solderability Test Methods 148

Through-Hole Package Designs and Materials 148

Surface Mount Package Designs and Materials 150

Tape Automated Bonding Package Design and Materials 152

7.4 IC Solderability Defects 152

Through-Hole Solderability Problems 152

SMT Solder Electroplating Process Defects 155

SMT Lead Finish Defects 158

SMT Solderability Problems Due to Mechanical Damage 159

TAB Solderability Problems 161

7.5 Solderability of IC Packages to PCBs 162

Printed Circuit Boards 162

Electronic Solders,Fluxes,and Pastes 163

7.6 Summary 165

HERMETICITY AND JOINING IN CERAMIC IC PACKAGES 167

8.1 Introduction 167

8.2 Materials for Hermetic IC Packaging 169

8.3 Hermeticity Testing—History 173

8.4 Theory of Hermeticity Testing 174

8.5 Gross-Leak Testing Methodology 177

8.6 Hermeticity Failure Analysis 178

8.7 Alternatives to Hermetic Packaging 182

8.8 Summary 183

ADVANCED INTERCONNECT TECHNOLOGY 187

9.1 Introduction 187

9.2 MCM Technology Classifications 188

9.3 MCM Materials Selection 190

Substrate Materials and Design 191

Polyimide Dielectrics 194

Test Substrates 195

Power Density 196

9.4 Die Mounting and Stress 198

Die Bond Adhesive Strength 199

Flip-Chip Technology 200

9.5 Die Interconnection 201

Wire Bond Technology 201

Bond Optimization 203

9.6 MCM Packages 204

Substrate-Based Packages 204

9.7 Summary 205

APPENDIX:TECHNIQUE SUMMARIES 209

1 Acoustic Microscopy(C-AM) 209

2 Atomic Absorption Spectrometry(AAS) 213

3 Auger Electron Spectroscopy(AES) 214

4 Ceramic Plate Test(CPT)for Evaluating Solderability of IC Devices 215

5 Coulometric Method for Solderability Evaluation 218

6 Decapsulation Techniques 222

7 Differential Scanning Calorimetry(DSC) 225

8 Dynamic Mechanical Analysis 227

9 Dynamic Secondary Ion Mass Spectrometry(Dynamic SIMS) 229

10 Electron Probe X-Ray Microanalysis(EPMA) 230

11 Energy-Dispersive X-Ray Spectroscopy(EDS) 231

12 Finite Element Analysis(FEA) 232

13 Fourier Transform Infrared Spectroscopy(FTIR) 235

14 Inductively Coupled Plasma Mass Spectrometry(ICPMS) 236

15 Inductively Coupled Plasma-Optical Emission Spectroscopy(ICP-OES) 237

16 In Situ Strain Gauges 238

17 Ion Chromatography 240

18 Mechanical Testing in IC Packaging 243

19 Scanning Electron Microscopy(SEM) 247

20 Scanning Tunneling Microscopy(STM)and Scanning Force Microscopy(SFM) 248

21 Static Secondary Ion Mass Spectrometry(Static SIMS) 249

22 Thermogravimetric Analysis(TGA) 250

23 Thermomechanical Analysis(TMA) 252

24 Torsional Braid Analysis(TBA) 255

25 Wetting Balance Method to Evaluate the Solderability of IC Devices 258

26 X-Ray Laminography 260

27 X-Ray Photoelectron Spectroscopy(XPS) 263

28 X-Ray Radiographic Inspection 264

Index 267