照明用LED封装 设计、制造和测试 英文PDF电子书下载

1 Introduction 1

1.1 Historical Evolution of Lighting Technology 1

1.2 Development of LEDs 2

1.3 Basic Physics of LEDs 6

1.3.1 Materials 6

1.3.2 Electrical and Optical Properties 10

1.3.3 Mechanical and Thermal Properties 18

1.4 Industrial Chain of LED 19

1.4.1 LED Upstream Industry 21

1.4.2 LED Midstream Industry 22

1.4.3 LED Downstream Industry 22

1.5 Summary 28

References 29

2 Fundamentals and Development Trends of High Power LED Packaging 33

2.1 Brief Introduction to Electronic Packaging 33

2.1.1 About Electronic Packaging and Its Evolution 33

2.1.2 Wafer Level Packaging,More than Moore,and SiP 36

2.2 LED Chips 37

2.2.1 Current Spreading Efficiency 37

2.2.2 Internal Quantum Efficiency 41

2.2.3 High Light Extraction Efficiency 43

2.3 Types and Functions of LED Packaging 48

2.3.1 Low Power LED Packaging 49

2.3.2 High Power LED Packaging 50

2.4 Key Factors and System Design of High Power LED Packaging 51

2.5 Development Trends and Roadmap 57

2.5.1 Technology Needs 57

2.5.2 Packaging Types 59

2.6 Summary 62

References 62

3 Optical Design of High Power LED Packaging Module 67

3.1 Properties of LED Light 67

3.1.1 Light Frequency and Wavelength 67

3.1.2 Spectral Distribution 69

3.1.3 Flux of Light 69

3.1.4 Lumen Efficiency 71

3.1.5 Luminous Intensity,Illuminance and Luminance 71

3.1.6 Color Temperature,Correlated Color Temperature and Color Rendering Index 76

3.1.7 White Light LED 80

3.2 Key Components and Packaging Processes for Optical Design 83

3.2.1 Chip Types and Bonding Process 83

3.2.2 Phosphor Materials and Phosphor Coating Processes 85

3.2.3 Lens and Molding Process 90

3.3 Light Extraction 93

3.4 Optical Modeling and Simulation 98

3.4.1 Chip Modeling 98

3.4.2 Phosphor Modeling 102

3.5 Phosphor for White LED Packaging 108

3.5.1 Phosphor Location for White LED Packaging 108

3.5.2 Phosphor Thickness and Concentration for White LED Packaging 118

3.5.3 Phosphor for Spatial Color Distribution 123

3.6 Collaborative Design 129

3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages 129

3.6.2 Application Specific LED Packages 134

3.7 Summary 144

References 144

4 Thermal Management of High Power LED Packaging Module 149

4.1 Basic Concepts of Heat Transfer 149

4.1.1 Conduction Heat Transfer 150

4.1.2 Convection Heat Transfer 150

4.1.3 Thermal Radiation 151

4.1.4 Thermal Resistance 153

4.2 Thermal Resistance Analysis of Typical LED Packaging 154

4.3 Various LED Packages for Decreasing Thermal Resistance 156

4.3.1 Development of LED Packaging 156

4.3.2 Thermal Resistance Decrease for LED Packaging 158

4.3.3 SiP/COB LED Chip Packaging Process 162

4.4 Summary 164

References 164

5 Reliability Engineering of High Power LED Packaging 167

5.1 Concept of Design for Reliability(DfR)and Reliability Engineering 167

5.1.1 Fundamentals of Reliability 168

5.1.2 Life Distribution 169

5.1.3 Accelerated Models 172

5.1.4 Applied Mechanics 175

5.2 High Power LED Packaging Reliability Test 179

5.2.1 Traditional Testing Standards,Methods,and Evaluation 179

5.2.2 Methods for Failure Mechanism Analysis 182

5.2.3 Failure Mechanisms Analysis 184

5.3 Rapid Reliability Evaluation 187

5.3.1 Material Property Database 190

5.3.2 Numerical Modeling and Simulation 194

5.4 Summary 211

References 211

6 Design of LED Packaging Applications 215

6.1 Optical Design 215

6.1.1 Introduction of Light Control 215

6.1.2 Reflectors 220

6.1.3 Lenses 232

6.1.4 Diffuser 272

6.1.5 Color Design and Control in LED Applications 277

6.2 Thermal Management 287

6.2.1 Analysis of System Thermal Resistance 287

6.2.2 Types of Heat Dissipation to Environment 293

6.2.3 Design and Optimization of Fin Heat Sink 298

6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems 303

6.3 Drive Circuit and Intelligent Control Design 311

6.3.1 Typical LED Wireless Intelligent Control System 311

6.3.2 Working Principles of Wireless Intelligent Control System 312

6.4 Summary 313

References 313

7 LED Measurement and Standards 317

7.1 Review of Measurement for LED Light Source 317

7.2 Luminous Flux and Radiant Flux 318

7.3 Measurement for Luminous Intensity 319

7.4 LED Chromaticity Coordinates 320

7.5 Dominant Wavelength Determination Algorithm 321

7.5.1 Curve Fitting Method 321

7.6 LED Color Purity 322

7.7 Color Temperature and Correlated Color Temperature of Light Source 323

7.8 Automatic Sorting for LEDs 324

7.9 Measurement for LED Road Lights 325

7.9.1 Electrical Characteristics 325

7.9.2 Color Characteristics 326

7.9.3 Light Distribution Characteristics 326

7.9.4 Dynamic Characteristics 326

7.9.5 Test of Reliability 329

7.10 Summary 329

References 329

Appendix:Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance 331

Index 349